Hold in a refrigerator. (0-10℃)

? It is recommended to use within 6 months from manufacturing date.

? The solder paste should be used as quickly as possible once lid has been opened.

? Unused solder paste in the jar should be refrigerated after re-applying the inner and outer lids.

? Prior to usage, solder paste should be removed from refrigeration for over 2 hours

until it reaches room temperature.

? We recommend to stir the solder paste by mixing machine before use it. When stir by a spatula,

open the jar after the solder paste is warmed up to room temperature and stir slowly to make

the paste homogeneous. Caution must be taken not to mix in air.

? After shooting the solder paste, mount components immediately and let it pass through

reflow furnace.

? Slowly heat the reflow furnace at 1.0 to 2.5℃/second till reaching 120 to 170℃.

Set peak temperature at 160 to 170℃ during pre-heating and 205 to 230℃ during reflow.

(Refer to next page.)

? This solder paste corresponds to No-Clean process, however confirmation may be required

whether No-Clean process is applicable under user’s expectancy.

? White residue (insulator) may appear after cleaning.

? Solder paste must be wiped off from spatula by applying solvent such as alcohol immediately after use.

? This solder paste includes Lead.

? The solder paste is not edible.

? The solder paste is for the industrial use only.

? Avoid contact with eyes and skin.

? Avoid inhalation of gases emitted by solder paste during use.

? Provide proper ventilation.

? If contact with skin, wiped off with like alcohol and wash with soap and water, immediately.

? Use rubber gloves and protective glasses, if necessary.

?

Prepared

Junichi Okano Hideto Takayama

（No sign for copy）

5. Delivery:

Usually 2 weeks from acceptance of order.

Approved

3. Caution:

4. Notice:

?HOW TO HANDLE Sn62U SS4M?

2. How to Use: