CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone. 

It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures 

for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 

1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for 

EMI gasket repair, bonding, and attachment in applications where moderate strength 

(less than 150 psi) is required. CHO-BOND 1038’s moisture cure silicone polymer 

system allows it to cure to the touch in 24 hours and provides a robust conductive and 

environmental seal over a wide range of application temperatures. For applications 

requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker 

Chomerics offers a solvent free version of CHO-BOND 1038 called CHO-BOND 1121. 

For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHOSHIELD 

1086 primer. Typical applications include man portable electronics, radar and 

communication systems, EMI vents, military ground vehicles, and shelters. 

. Medium paste 

. No VOCs version: 

CHO-BOND 1121 

. Easy to use, no weighing or mixing required. 

. Excellent conductivity 0.010 ohm-cm 

. 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure Curing curing, wide range of application 

temperatures. 1 week for full cure. 

. No corrosive by-products generated during curing to damage substrate. 

. Easy to dispense, apply and spread, can be used on overhead or vertical surfaces. 

. Minimal shrinkage, no permits or ventilation required.